REES Workshop 2017 - Technical Committee
- Wolfgang Ecker, Infineon Technologies AG, Germany
- Luc van Dijk, NXP, Netherlands
- Dip Goswami, TU Eindhoven, Netherlands
- Masahiro Fujita, University of Tokyo, Japan
- Andreas Gerstlauer, University of Texas at Austin, USA
- Michael Glass, University of Ulm, Germany
- Daniel Große, University of Bremen, Germany
- Wolfgang Kunz, TU Kaiserslautern, Germany
- Smail Niar,Universite de Valenciennes, France
- Jan-Hendrick Oetjens, Bosch, Germany
- Alexander Viehl, FZI, Germany
- Christian Weis, TU Kaiserslautern, Germany
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