MESDIE: Microelectronic EMC System Design for High Density Interconnect and High Frequency Environment

The basic objective of the MESDIE project is to develop and model new chip sets and dedicated modules (HDP/HDI) for different applications with regard to harsh physical coupling aspects and problems of system integration of selected demonstrators (application specific demonstrator) to evaluate the project results in terms of product relevance and specific demonstrators to test the developed during the project runtime EMC/HDP/RF solutions as found typically in telecommunication, automotive, consumer and multimedia application. Design techniques resulting from the project will enable the modeling and simulation of these aspects followed by an analysis at user level.

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