Chip execs see 20 nm variants, 3-D ICs ahead
Do, 2012/05/03 - 09:12 – Treytnar, Dieter
http://www.eetimes.com/electronics-news/4371833/Chip-execs-see-20-nm-variants--3-D-ICs-ahead
interessante Statements u.a. "Cost is biggest issue of 3-D ICs right now," said Yu of Qualcomm.
