Authors: Thomas Fries, FRT GmbH, DE; B. Tröger (FRT); B. Richarz (FRT); M. Hildebrandt (FHG); R. Dudek (FHG); S. Rzepka (FHG); L. Scheiter (CWM); E. Noack (CWM); B. Seiler (CWM)
Devices under Thermal Load
Abstract:
Presentation of TRACE project partners Fries, Fraunhofer ENEAS, and CWM, held at the 4th European Expert Workshop on Reliability of Electronics and Smart Systems (EuWoRel), October 18-19 2016 at Fraunhofer Forum.
Publication Date: 2016/10/18
Location of Publication: Fraunhofer Forum
Keywords: Automotive; Test
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